Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Insights from the minds of innovators
Orbotech's Frontline Accelerates Time to Market
Today’s PCB (printed circuit board) engineering departments face many challenges in their process planning, including long and complex planning...
PROLITH™: Virtual Patterning Solution
PROLITH™ 2020b and PROLITH™ Enterprise 2020b PROLITH™ 2020b is the latest version of our virtual lithography and patterning system....
John C. Robinson Named SPIE Fellow
John C. Robinson, Senior Principal Scientist in the Industry and Customer Collaborations (ICC) group at KLA, has been elected...
KLA Talks Automotive Semiconductors at #SPIElitho
KLA is a longtime participant and sponsor of the upcoming SPIE Advanced Lithography Digital Forum held on February 22-26,...
Bay Area to Great Lakes: Gary White’s Journey
It’s no secret that we here at KLA take a great deal of pride in our global presence. While...
KLA Announces Fourth Quarter Earnings
Check out the infographic below to see some of KLA’s key financial information from the 2020 December Quarter, as...
SPTS Co-Develops Drug-Administering Microneedles
As the world looks to vaccines to help address the continued COVID outbreak, the healthcare industry is using KLA’s...
Happy Holidays from KLA!
Ever wondered how KLA keeps up the quality and precision we’re known for? As our gift to you, we’re...
PWG5™: The Complete Wafer Geometry System for IC Fabs
3D NAND memory is pervasive in today’s electronics – mobile devices, laptops, data centers, automobiles, and USB drives are...