Innovation Beyond the Chip: Exploring Advanced Packaging Architectures
For decades, the semiconductor industry relied on Moore’s Law—the idea that the number of transistors on a chip doubles roughly...
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Insights from the minds of innovators
KLA Israel Showcases Sustainability-Themed Hackathon Projects
Sixty-five hackers in 10 project teams at KLA Israel came together in their third annual hackathon, with this year’s...
MicroLEDs, the Next Big Thing for Displays?
KLA is proud to be part of the most significant technological breakthroughs that help create the devices and ideas...
KLA Announces First Quarter Earnings
The infographic below highlights KLA’s key financial information from the earnings report for the first quarter, as well as...
Compound Semiconductor Innovation Advances EVs and Other Green Technologies
As the world works to reduce greenhouse gas emissions, global adoption of electric vehicles (EVs) is driving an increased...
Earth Day, Every Day at KLA
As the world celebrates Earth Day on Friday, April 22, KLA recognizes the work its employees do around the...
SPIE: We're on Our Way to San Jose
As a longtime participant and sponsor of the SPIE Advanced Lithography + Patterning conference, we’re looking forward to reconnecting...
Teron™ SL670e and Teron™ SL670e XP: EUV Reticle Quality Control
Extreme ultraviolet (EUV) lithography is a key technology inflection for the semiconductor industry. While shifting the scanner wavelength to...
KLA’s Frontline Cloud Services Sharply Reduces DFM Analysis Time
Imagine if manufacturers could reduce design-for-manufacturability (DFM) analysis time by 96% and, ultimately, the time to market for complex...
KLA Location Spotlight: Migdal HaEmek, Israel
Next stop on our virtual world tour of KLA’s global locations is in Israel. In the second edition of...