The Zeta™️ optical profiler is ideally suited for 3D measurement at various stages of solar device manufacturing, including metrology of solar cell texture and topography of busbars and finger lines. Other process step characterization by Zeta 3D optical profilers includes diamond wire topography, mono-silicon and polysilicon wafer bow, roughness, and roll-off, AR coating thickness and reflectance, and laser groove topography.
The KLA Instruments optical profilers utilize a number of different objective lenses, depending on the system configuration and the application. This application note discusses different objective types and the various factors affecting magnification and resolution.
The Filmetrics® F20, F40 and F3-CS Thin-Film Analyzers are used for thickness and uniformity measurement of parylene coatings, which are widely used in the biomedical industry due to their unique properties.
The Filmetrics® F20 and F40 Thin-Film Analyzers use spectral reflectance technology for layer thickness measurement of different types of coatings used on medical devices. This discussion includes thickness measurement of a pharmacological coating on a medical stent, thickness of a polymer wire coating, and angioplasty balloon wall thickness.
The Filmetrics® F10-RT-UVX was used to measure a multilayer dielectric stack of unknown materials, resolving not only the number of layers and the index of refraction of the high index material, but the thickness of each individual layer.
The Filmetrics® F10-RT Thin-Film Analyzer was used to measure the index of refraction of graphene, using the simultaneous capture of reflectance and transmittance spectra. The F50 thin film mapping tool was used to measure and map graphene monolayer and bilayer uniformity across an entire wafer.
KLA Instruments™ Tencor™ P-Series stylus profilometers offer pattern recognition capability for automated surface analysis. This application note describes pattern recognition and its usage for automated sample alignment for the Tencor P-7, P-17, P-170, and HRP-260 profilometers.
The Zeta-20 optical profiler provides a quick, non-destructive method for measuring the profile and depth of high aspect ratio trenches to characterize the lag effect of reactive ion etching (RIE).
The Zeta-Series optical profilers provide accurate measurement and automated analysis of high aspect ratio structures such as HEMT vias using non-destructive and high throughput metrology techniques.
This application note discusses components and technologies specific to the KLA Instruments stylus profilers, including topography measurement, force control, scanning mechanism, stylus types and dimensions, and stylus profilometry applications.
Multi-Step Analysis is a new automated algorithm that automatically measures step height/trench depth for up to 30 features along a scan profile, including automatic cursor placement. This capability significantly improves time-to-results and removes measurement variability relative to previous manual methods.
Stylus profilers from KLA Instruments are available with advanced 2D/3D surface analysis software to provide additional insight into profilometer measurement data. The Apex software includes data processing, analysis, visualization and reporting capabilities for both 2D profiles and 3D topography.
For Tencor™ and P-Series stylus profilers, the full-diameter profile measurement can be taken before and after film deposition to calculate the induced thin film stress. Hardware and software usage recommendations are also included.
Zeta™ 3D optical profilers are used to measure surface roughness of N95 face masks, sapphire wafers for LED devices, and porous chucks. An overview of Zeta measurement technology is also included.
The Zeta-20 optical profiler with ZDot™ technology was used to measure open channel and closed channel microfluidics devices, including step height and surface roughness inside the channel.
The topography sensor is one component of the stylus measurement head, which is used to track the surface of the sample being measured. Three major sensor types are LVDT, Optical Lever and LVDC, and this application note discusses the design of each.
The depth of SIMS craters generated by ion beam milling is used to determine the concentration of impurities. The objective of this application note is to present a technique to accurately measure the depth of shallow SIMS craters using a stylus profiler.
KLA Instruments™ stylus profilometers may be used with different styli to optimize measurements for specific applications. The KLA profilers, including the Alpha-Step® D-Series, Tencor™ P-Series and High Resolution Profiler (HRP®) Series all use the same stylus design. This application note discusses the various types of styli available for these stylus profilometers and typical applications for their use.
When using the Tencor™ P-7, P-17 and P-170, and HRP®-260 surface profilometers, the user sets up scan recipes which include calculations of various 3D surface metrology measurement parameters, including surface roughness. This application note provides mathematical detail regarding the equations used to generate the parameter values.
When using the Tencor™ P-7, P-17 and P-170, and HRP®-260 surface profilometers, the user sets up scan recipes which include calculations of various 2D surface metrology measurement parameters, including surface roughness. This application note provides mathematical detail regarding the equations used to generate the parameter values.
The Zeta™ optical profilometer has the advantage of providing uniform lateral resolution without contacting potentially delicate surface features. KLA Instruments’ proprietary ZDot™ technology utilizes a structured illumination technique to enhance the vertical resolution of the objective lens of the Zeta optical microscopes. This application note discusses ZDot technology and its usage and applications.
Author: Dr. Diane Hickey-Davis, Dr. Ian Holton
Publication: Commercial Micro Manufacturing International Vol 9 No.1
Author: Dr. Diane Hickey-Davis
Publication: Commercial Micro Manufacturing International Vol 9 No.3
Author: Vamsi Velidandla, et. al.
Publication: 37th IEEE Photovoltaic Specialists Conference (2011)
Author: Dr. Ian Holton
Publication: Commercial Micro Manufacturing International Vol 6 No.1
Author: Nelluri Srinivas, et. al.
Publication: South Asian Journal of Engineering and Technology Vol.1, No.1 (2015) 41–45
Author: Vamsi Velidandla, et. al.
Publication: 37th IEEE Photovoltaic Specialists Conference (2011)