InnerSense Introduces a New Diagnostics Instrument for High Volume
Semiconductor Manufacturing Environment
Released
on: October 22, 2009, 3:36 am
Author: InnerSense
Ltd.
Industry: Semiconductors
Ein
Harod, ISRAEL, October 22, 2009 – InnerSense Ltd., a leading
global developer and manufacturer of precision auto-diagnostics
instruments for the semiconductors industry, introduced a new
system for eliminating handling-related yield loss in 300mm wafer
process tools running high volume production.
The new system, coined SMW2, consists of a 300mm wafer instrumented
with sensitive three dimensional vibration sensors, and a “Smart
FOUP™” that serves as a recharge and communication
station, as well as a clean storage container. The “Smart
FOUP” employs contact-less recharging and data transfer
that enable the system to interface with standard robotic wafer
handlers and be operated with minimal interruption to the production
line.
Yigal
Tomer, InnerSense’s Co-CEO, commented, “The new system
is based on six years of excursion control experience. Built on
our successful Smart Wafer technology, it brings to the high volume
production environment the monitoring ability that has enabled
predictive maintenance and statistical analysis of tool condition,
previously available in engineering mode only.”
In
addition to 3D vibration sensing and FOUP-based, contact-less
reader/recharger station, the SMW2 features advanced analytical
tools that facilitate troubleshooting, SPC-based trend identification
and tool-to-tool comparison. These tools allow even untrained
operators to use the system effectively to enhance the availability
of expensive wafer process equipment.
ABOUT “SMART WAFER” TECHNOLOGY
A semiconductor wafer is typically handled hundreds of times during
its manufacturing process. Collisions and rubbing against other
objects may result in edge cracks and back scratches. Uneven or
abrupt lifting may cause skidding and misalignment, or even dropping
the wafer inside the tool. Particles generated in mechanical contact
cause contamination. In total, handling related defects are believed
to cause over 30% of wafer yield loss.
Instrumented with sensitive multi-axial accelerometers, InnserSense’s
Smart Wafer travels just like a production wafer through the entire
path in the process tool and record the vibrations and tilting
it experiences during the various handling operations. The recorded
data is analyzed to pinpoint problem sources and detect mechanism
deterioration to trigger predictive maintenance. By providing
quantitative and statistical information on a regular basis, the
Smart Wafer becomes a valuable tool for Advanced Equipment Control
(AEC). The resulting enhanced yield and productivity translate
to significant cost savings.
ABOUT
INNERSENSE
Established in Jerusalem, Israel, in 2002, InnerSense develops,
manufactures and markets diagnostic solutions for the semiconductor,
flat panel display and solar cell industries. InnerSene’s
products, such as the Smart Wafer described above, help customers
in over 25 fabs around the world increase their manufacturing
yields and reduce operation and maintenance costs. InnerSense
supports its customers through operations in China, Taiwan, Japan,
Korea, Europe and the USA. Ricor Cryogenic and Vacuum Systems
of Ein Harod, Israel, has acquired InnerSense in 2008.
Contact Details: Yakov Bienenstock yakov@innersense-semi.com
tel: +972 2 563-4446 mobile: +972 54 476-8966
www.innersense-semi.com
2009
